Intel Corporation and Huawei, have announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish a joint lab based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
“Huawei has been committed to LTE TDD commercial deployment worldwide,” said Deng Taihua, president LTE TDD & WiMAX &TDS wireless networks, Huawei. “We will continuously invest in LTE TDD research and deployment as well as the global expansion of LTE TDD networks. We are excited to partner with Intel to accelerate the development of our technology and provide our customers with leading LTE TDD solutions.”
The collaboration will utilize Huawei´s expertise in LTE TDD network infrastructure technologies and Intel’s innovative and cost-optimized mobile communication platforms to expedite the maturity and deployment of LTE TDD. By connecting directly to Huawei’s infrastructure, Intel will carry out end-to-end testing of its mobile platforms in a real life environment.
“Collaborative innovation is Intel’s strategy in China,” said W.K Tan, VP of Intel IAG & Head of MCG, China. “The engagement with Huawei will take advantage of the two companies’ strengths and leading technologies. We are committed to working together with partners in China to build a healthy LTE TDD ecosystem within China and even beyond.”
In Malaysia, 3G operators such as Maxis, Celcom Axiata, DiGi & U Mobile are gearing up to deploy FD-LTE which is different from TD-LTE. So far only Packet One(P1) has announced plans to deploy TD-LTE next year however it will partnering ZTE for that.
Earlier this week, Huawei announced that it showcased the world’s first 4×4 MIMO (Multiple Input Multiple Output) carrier aggregation solution for LTE TDD at the Huawei-hosted 2012 Global Analyst Summit in Shenzhen, China. This solution adopts 4×4 MIMO technologies and allows the peak data rate for a single end user to reach up to 520Mbps.
